2 hasil untuk "Hashim Uda"

Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

Gan Chong Leong; Hashim Uda

PLoS ONE, Vol. 8 No. 11 · 2013 · Inggris · PLOS Scopus

This paper compares and discusses the wearout reliability and analysis of Gold (Au), Palladium (Pd) coated Cu and Pd-doped Cu wires used in fineline Ball Grid Array (BGA) package. Intermetallic compound (IMC) thickness measurement has been carried out to estimate the coefficient of diffusion (Do)…

Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

Gan Chong Leong; Hashim Uda

PLoS ONE, Vol. 9 No. 1 · 2014 · Inggris · PLOS Scopus