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Chip
Scopus
ISSN 2709-4723 · Elsevier · 134 articles in the index
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Journal Article
A 126.5 dB power supply rejection ratio, 1.02 ppm/°C bandgap reference in 0.18 μm CMOS
This study proposes a high-precision bandgap reference (BGR) architecture targeting advanced process nodes, addressing key challenges of process variations, temperature drift, and power supply noise. The design employs chopping to dynamically suppress operational amplifier offset and low-frequency…
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Journal Article
Degradation mechanism and reliability tests for silicon carbide power metal-oxide semiconductor field-effect transistors: challenges and progress
As a representative of third-generation semiconductor power devices, silicon carbide metal-oxide semiconductor field-effect transistors (SiC MOSFETs) are revolutionizing the field of power electronics due to their excellent thermal conductivity, power density, high breakdown voltage, and…
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Journal Article
Emerging CMOS compatible memristor for storage technology and neuromorphic computing applications
Memristor-based in-memory computing technology represents a paradigm shift in data processing and storage by integrating computation and memory functionalities within a single element, showing great potential in artificial intelligence, big data analytics, and the Internet of Things (IoT) fields…
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Journal Article
System-level simulation of antimonide focal plane arrays
A comprehensive multiphysics simulation framework was developed to systematically assess the key performance metrics of antimonide-based infrared detectors across various pixel structures and operating conditions. The study focuses on modulation transfer function (MTF), optical and electrical…
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Journal Article
Overload resistance of inertial sensors: enabling enhanced precision and robustness to expand applications
Micro-electro-mechanical systems (MEMS) inertial sensors are widely used in industrial, aerospace, and military applications for detecting and measuring acceleration, tilt, shock, vibration, rotation, and multi-degree-of-freedom (DoF) motion. However, under extreme conditions, these sensors can…
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Journal Article
Broadband power splitter for three-dimensional photonic integrated chips
Three-dimensional (3D) photonic integrated circuits have emerged as a promising solution for the miniaturization and integration of chips, offering significant advantages in functional density and spatial scalability. Optical power splitters play a central role in photonic integrated circuits by…
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Journal Article
Through-silicon via–enabled high-fill-factor analog micromirror arrays based on electrothermal actuation
Large-scale analog micromirror arrays (AMAs) with high fill factor are critical for high-efficiency fast beam steering. Electrothermally actuated micromirrors can provide large-range analog angular scanning, but electrothermal AMAs have limited array size and fill factor due to the electrical…
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Journal Article
Unraveling thermomechanical stress-driven grain evolution and rotation in through-silicon vias for advanced packaging
As the dimensions of Cu-filled through-silicon vias (TSVs) in 3D integrated circuits (ICs) continue to scale down, the microstructure of the Cu filler critically impacts the mechanical integrity and reliability of advanced packaging. This study develops a physics-based numerical framework to…
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Journal Article
Chip-scale Rydberg atomic electrometer
An ideal electrometer should measure electric fields accurately while causing minimal disturbance to the field itself. Rydberg atomic electrometers are promising candidates for ideal electrometry due to their SI traceability and noninvasive nature. However, in practice, the atomic vapor cell shell…
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Journal Article
Monolithic β-Ga
Digital control systems cannot directly provide the voltage swing and gate charge necessary for high-speed operation of power metal oxide semiconductor field-effect transistors. We report a monolithic β-Ga 2 O 3 gate-driver integrated circuit fabricated on a 0.96 mm 2 footprint. The circuit…
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Journal Article
Piezoelectric active air-cooling devices
As the power consumption and miniaturization of electronic devices increase, traditional liquid-cooling and fan systems struggle to meet the high heat flux requirements, especially in space-constrained devices. Piezoelectric effect can convert electrical energy into mechanical energy, which is…
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Journal Article
Two-dimensional materials-based artificial neuron devices and their working mechanism
The rapid development of artificial intelligence and robotics has created increased demands for the efficiency and performance of computer hardware. Neuromorphic computing provides a platform to process vast datasets with low power consumption, addressing the critical bottlenecks in conventional…
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Journal Article
A hybrid algorithm-driven approach for efficient design of terahertz molecule-specific metasensors
Metasurfaces, owing to their capacity to significantly enhance localized electric fields, have emerged as crucial tools for improving sensor sensitivity and enabling efficient biomolecular detection in the terahertz range. However, most terahertz metasensors in current research focus only on a…
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Journal Article
Fault modeling, testing, and repair for chiplet interconnects
With the continuous advancement of semiconductor technology, chiplet technology has gained importance due to its significant advantages in enhancing performance, reducing power consumption, and saving space. However, vertical interconnect structures in 3D integrated circuits (ICs), such as…
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Journal Article
Demonstration of acousto-optic modulation using an integrated Michelson interferometer
Integrated photonic acousto-optic (AO) modulators have emerged as critical components across diverse fields ranging from classical optical manipulation to quantum information processing. Here, by using a lithium niobate-chalcogenide heterogeneous integration platform, an integrated AO modulator…
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Journal Article
Multifunctional graphene/organic transistor enabled by polyethyleneimine (PEIE)-induced charge tunneling and trapping effects
Graphene/organic transistors (GOTs) hold significant potential for multifunctional bio-inspired optoelectronic applications, integrating sensing, filtering, and neuromorphic processing in a single device. In this study, we demonstrated a GOT based on a graphene/polyethyleneimine (PEIE)/bulk…
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Journal Article
Core-shell microdisk with InGaN/GaN quantum wells for dual-band whispering gallery mode lasing
The development of high-quality, stable, and cost-effective micro/nano dual-band lasing remains a crucial challenge for multifunctional applications. In this study, we demonstrated high-Q dual-band whispering gallery mode lasing in an independent core-shell microdisk, emitting both ultraviolet and…
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Journal Article
Nanometer scale thermal measurement for next-generation electronics via scanning Joule expansion microscopy
As semiconductor devices continue to scale down, increasing power densities introduce significant thermal management challenges. High-resolution thermal imaging is crucial for understanding localized heating and ensuring device reliability. Scanning Joule expansion microscopy (SJEM) has emerged as…
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Journal Article
On-chip signal isolation based on mode orthogonality in plasmonic dual-mode transmission line
We proposed a spoof surface plasmon polariton (SSPP) dual-mode transmission line (DMTL) formed by mirror serpentine periodic structures (MSPSs), which features the odd- and even-mode dispersion curves overlapping in a wide frequency range. With the mode exciter and mode recognizer in reciprocal…
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Journal Article
Through-silicon via advanced packaging technology and its radio frequency applications
Through-silicon via (TSV) technology is widely recognized as one of the most promising interconnect solutions, owing to its ability to dramatically shorten interconnect paths, reduce package dimensions, decrease power consumption, and enhance device performance. Conventional TSVs embedded in…